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International collaboration EU and Japan on semiconductors (DIGITAL-JU-CHIPS-2026-SG-JAPAN)
Projects are expected to contribute to the following expected outcomes: Advanced heterogeneous integration, particularly in 2.5D and 3D packaging and integrated photonics, to support AI functionalities.
Grant (non-repayable) Opening soon
- Funder
- European Commission: Digital Europe Programme (DIGITAL)
Funder profile and all of its programs - Amount
- €3,000,000 to €5,000,000 EU contribution per grant; €5,000,000 topic budget, about 2 grants expected (published on the EU Funding & Tenders Portal).
- Where
- European Union
- Eligibility
- Open to businesses, self-employed people, nonprofits, colleges, universities, schools or research institutions and state, provincial, local or tribal governments. Open to legal entities eligible under the Digital Europe Programme (DIGITAL) rules (usually consortia from EU Member States and associated countries); action type: DIGITAL JU Simple Grants. Check the topic conditions on the portal.
- Sectors
- Business and entrepreneurship, Environment and conservation, Technology, software and R&D, Employment and workforce
- Deadline
- Closes 8 December 2026
- Source
- EU Funding & Tenders Portal (DIGITAL-JU-CHIPS-2026-SG-JAPAN)
- Last checked
- 2 November 2026
- Funder contacts
- Contact details Unlock full profile / Sign up
From official open data: official page returned HTTP 200 on 2026-11-02. The summary is from the official listing; the eligibility line is our plain-language reading of its eligibility codes. Confirm details on the official page.
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